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Understanding the Pros and Cons of SMD and Through-Hole Technology

2026-01-06

Son şirket haberleri Understanding the Pros and Cons of SMD and Through-Hole Technology

 

CONTENTS

  • Key Takeaways
  • Advantages of Surface Mount Technology
  • Disadvantages of Surface Mount Technology
  • Advantages of Through-Hole Technology
  • Disadvantages of Through-Hole Technology
  • Practical Uses of SMD vs Through-Hole Parts
  • Cost and Assembly Process Comparison
  • FAQ

Key Takeaways

  • Surface Mount Technology (SMT) enables smaller, lighter electronics (e.g., smartphones) with automated, high-speed assembly.
  • Through-Hole Technology (THT) offers stronger mechanical bonds, ideal for rugged applications (e.g., aerospace) and prototyping.
  • SMT reduces costs for mass production, while THT excels in high-power/high-voltage systems.
  • Project requirements (size, durability, production volume) dictate the optimal technology choice.

Advantages of Surface Mount Technology

Small Size and Lightweight Design

SMT places components directly on the PCB surface, eliminating the need for drilled holes. This allows:

  • Higher component density (60–90% size reduction vs. THT).
  • Slimmer designs for consumer electronics like smartphones and wearables.

Fast Assembly with Automation

Automated SMT systems enable high-volume production:

 

Metric Value
Market Share (2023) 46.66%
Market Value USD 2,707.03 Million
Projected CAGR 8.50%

Cost Efficiency

  • No drilling reduces PCB fabrication costs.
  • Automated placement lowers labor expenses.
  • Smaller components often cost less than through-hole parts.

High-Frequency Performance

SMT’s short leads minimize inductance and capacitance, ideal for RF/microwave circuits (e.g., 10GHz+ systems). Testing at Giga Test Labs shows minimal impedance issues in SMT designs.

Disadvantages of Surface Mount Technology

Weak Mechanical Strength

Surface-mounted components are vulnerable to:

  • Vibration-induced solder joint failure.
  • Impact damage in rugged environments.

Difficult Manual Assembly/Repair

  • Tiny components require specialized tools for placement/removal.
  • Less than 15% of SMT parts are reusable, increasing prototyping costs.

Unsuitable for High-Power Applications

Small SMT components struggle with:

  • High current/voltage loads.
  • Thermal management in power-hungry systems.

Advantages of Through-Hole Technology

Strong Mechanical Bond

Through-hole leads inserted through PCB holes create durable connections, ideal for:

  • Industrial machinery and aerospace systems subject to vibration.
  • High-stress environments like factory floors or aircraft.

Ideal for Prototyping

Larger component size facilitates:

  • Easy manual placement/removal during design iterations.
  • Faster troubleshooting for hobbyists and engineers.

High-Power/High-Voltage Capability

THT components handle:

  • Heavy electrical loads in power supplies and amplifiers.
  • High-voltage circuits in renewable energy systems.

Disadvantages of Through-Hole Technology

Larger Size and Weight

 

Component Type Size Reduction Weight Reduction
Through-Hole 0% 0%
Surface Mount 60–90% Up to 90%

Slower Assembly

  • Manual insertion of leads into drilled holes.
  • Wave soldering adds production steps, slowing mass manufacturing.

Higher Costs for Scale

  • Drilling and manual labor increase production expenses.
  • Lower component density per PCB compared to SMT.

Practical Uses of SMD vs Through-Hole Parts

Where SMT Shines

  • Consumer Electronics: Phones, tablets, wearables.
  • High-Volume Production: TVs, gaming consoles, IoT devices.

Where THT Excels

 

Industry THT Demand (%) Examples
Aerospace & Defense 22% Flight systems, satellite components
Industrial Automation 30% Motor controllers, power units
Automotive N/A EV batteries, fuses

Mixed Technology Approach

  • Combine SMT for compactness and THT for durability in:
    • Automotive ECUs and industrial control panels.
    • High-power consumer electronics (e.g., audio amplifiers).

Cost and Assembly Process Comparison

Cost Breakdown

 

Aspect Through-Hole (THT) Surface Mount (SMT)
Assembly Speed Slower Faster
Component Density Lower Higher
Initial Costs Lower Higher
Mass Production Cost Higher Lower

Assembly Methods

  • SMT: Reflow soldering (automated, high-speed).
  • THT: Wave soldering (manual/selective for delicate parts).

Repair and Maintenance

 

Feature SMT Parts THT Parts
Repair Difficulty High (small size) Low (accessible leads)
Testing Ease Low (compact design) High (exposed leads)

FAQ

  • What’s the core difference between SMT and THT?SMT mounts components on the surface, while THT uses through-holes. SMT prioritizes miniaturization; THT prioritizes strength.
  • Can SMT and THT coexist in a design?Yes—mix SMT for density and THT for high-power/mechanical stability in complex systems.
  • Why is SMT better for mass production?Automated placement reduces labor costs and speeds up assembly, ideal for high-volume runs.
  • When should I choose THT over SMT?For rugged environments, high-power applications, or projects requiring easy prototyping/repairs.
  • How does technology choice impact costs?SMT saves money on large orders via automation; THT incurs higher labor/drilling costs but excels in durability.

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